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Thermal Requirements Hardware Preparation and Installation
MVME7100 Single Board Computer Installation and Use (6806800E08A)
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2.3.3 Thermal Requirements
The MVME7100 module requires a minimum air flow of 10 CFM uniformly distributed across
the board, with the airflow traveling from the heat sink to the PMC2 site, when operating at a
55°C (131°F) ambient temperature.
2.3.4 Thermally Significant Components
The following table summarizes components that exhibit significant temperature rises. These
are the components that should be monitored in order to assess thermal performance. The
table also supplies the component reference designator and the maximum allowable operating
temperature.
You can find components on the board by their reference designators as shown in Figure 2-1
and Figure 2-2 on the next page. Versions of the board that are not fully populated may not
contain some of these components.
The preferred measurement location for a component may be junction, case, or ambient as
specified in the table. Junction temperature refers to the temperature measured by an on-chip
thermal device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.
Table 2-4 Thermally Significant Components
Reference
Designator Generic Description
Maximum Allowable
Component Temperature
in Centigrade Measurement Location
U27, U4 Gb Ethernet Transceiver 0
° to +70° Ambient
U25, U26, U28 PCI-X/PCI-Express
Bridge
-40
° to +85° Ambient
U22 PCI-Express Bridge -40
° to +85° Ambient
U24 VME Bridge 0
° to + 70° Ambient
U10, U11, U12,
U13, U14, U56,
U57, U58, U59,
U6, U60, U61,
U62, U63, U64,
U7, U8, U9
DDR2 SDRAM 0
° to +95° Case
U20 MPU 0
° to +105° Junction