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12 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
2.1 Package Mechanical Requirements
The Intel 5000 Series chipset MCH package has an integrated heat spreader (IHS) that
is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load
limits must not be exceeded during heatsink installation, mechanical stress testing,
standard shipping conditions and/or any other use condition.
Note:
1. The heatsink attach solutions must not include continuous stress to the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
2. These specifications apply to uniform compressive loading in a direction
perpendicular to the IHS top surface.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
§
Figure 2-3. MCH Package Dimensions (Bottom View)
42.5 + 0.05
11 252321191715139753127293733 3531
2822 26242018161412108642 36343230 38
A
AJ
AE
AC
AA
U
R
N
L
J
G
E
C
W
AG
AL
AN
AR
AU
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
AK
AM
AP
AT
AV
B
A
B
42.5 +
0.05
C A
0.
2
- A
-
37X
1.092
20.202
20.202
37X 1.092