Reference Thermal Solution
32 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide
6.5.6 Clip Retention Anchors
For Intel 5000 Series chipset-based platforms that have very limited board space, a clip
retention anchor has been developed to minimize the impact of clip retention on the
board. It is based on a standard three-pin jumper and is soldered to the board like any
common through-hole header. A new anchor design is available with 45° bent leads to
increase the anchor attach reliability over time. See Appendix Thermal Solution
Component Suppliers for the part number and supplier information.
6.6 Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. Some general recommendations are shown in Table 6-2.
Figure 6-6. Tall Torsional Clip Heatsink Extrusion Profile
Table 6-2. Reliability Guidelines (Sheet 1 of 2)
Test
(1)
Requirement Pass/Fail Criteria
(2)
Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis Visual Check and Electrical
Functional Test
Random Vibration 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz Visual Check and Electrical
Functional Test