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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 17
Thermal Metrology
5 Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the MCH case temperatures. Section 5.1 provides guidelines on
how to accurately measure the MCH case temperatures. Section 5.1.8 contains
information on running an application program that will emulate anticipated maximum
thermal design power (Figure 5-1).
5.1 MCH Case Temperature Measurement
Intel 5000 Series chipset MCH cooling performance is determined by measuring the
case temperature using a thermocouple. For case temperature measurements, the
attached method outlined in this section is recommended for mounting a
thermocouple.
Special care is required when measuring case temperature (T
C
) to ensure an accurate
temperature measurement. Thermocouples are often used to measure T
C
. When
measuring the temperature of a surface that is at a different temperature from the
surrounding local ambient air, errors may be introduced in the measurements. The
measurement errors can be caused by poor thermal contact between the thermocouple
junction and the surface of the integrated heat spreader, heat loss by radiation,
convection, by conduction through thermocouple leads, or by contact between the
thermocouple cement and the heatsink base. To minimize these measurement errors,
the approach outlined in the next section is recommended.
5.1.1 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended that you use
the equipment (or equivalent) given in. Table 5-1.
Table 5-1. Thermocouple Attach Support Equipment (Sheet 1 of 2)
Item Description Part Number
Measurement and Output
Microscope Olympus Light microscope or equivalent SZ-40
Digital Multi-m
eter Digital Multi Meter for resistance measurement Not Available
Test Fixture(s)
Micromanipulator*
(See note)
Micromanipulator set from YOU Ltd. or equivalent Mechanical
3D arm with needle (not included) to maintain TC bead location
during the attach process.
YOU-3
Miscellaneous Hardware
Super Bonder* 498
Thermal Cycling
Resistant Instant
Adhesive
Super glue w/thermal characteristics 49850
Adhesive Accelerator Loctite 7452* for fast glue curing 18490
Kapton Tape For holding thermocouple in place or equivalent Not Available
Thermocouple Omega, 36 gauge, “T” Type 5SRTC-TT-36-72