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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 25
Thermal Metrology
Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the
IHS top surface by running a flat blade on top of the IHS for example.
5.1.8 Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design
power on a Intel 5000 Series chipset MCH when used in conjunction with the Dual-Core
Intel
®
Xeon
®
Processor 5000 Series Processor (1333 MHz). The combination of the
above mentioned processor(s) and the higher bandwidth capability of the Intel 5000
Series chipset enable higher levels of system performance. To assess the thermal
performance of the chipset MCH thermal solution under “worst-case realistic
application” conditions, Intel is developing a software utility that operates the chipset
at near worst-case thermal power dissipation.
The power simulation software being developed should only be used to test thermal
solutions at or near the thermal design power. Figure 5-1 shows a decision flowchart for
determining thermal solution needs. Real world applications may exceed the thermal
design power limit for transient time periods. For power supply current requirements
under these transient conditions, please refer to each component’s datasheet for the
ICC (Max Power Supply Current) specification. Contact your Intel field sales
representative to order the thermal models and user’s guides.
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