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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 13
Thermal Specifications
3 Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the target
power level to which the thermal solutions should be designed. TDP is not the
maximum power that the chipset can dissipate.
For TDP specifications, see Table 3-1 for the Intel
®
5000P chipset MCH, Table 3-2 for
the Intel
®
5000V chipset MCH, and Table 3-3 for the Intel
®
5000X chipset MCH. FC-
BGA packages have poor heat transfer capability into the board and have minimal
thermal capability without thermal solution. Intel recommends that system designers
plan for a heatsink when using Intel 5000 Series chipset.
3.2 Case Temperature
To ensure proper operation and reliability of the Intel 5000 Series chipset MCH, the
case temperatures must be at or between the maximum/minimum operating
temperature ranges as specified in Table 3-1 through Table 3-3. System and/or
component level thermal solutions are required to maintain these temperature
specifications. Refer to Chapter 5, “Thermal Metrology” for guidelines on accurately
measuring package case temperatures.
Note: These specifications are based on preliminary silicon characterization, however, they
may be updated as further data becomes available.
Note: These specifications are based on preliminary silicon characterization; however, they
may be updated as further data becomes available.
Table 3-1. Intel® 5000P Chipset MCH Thermal Specifications
Parameter Value Notes
T
case_max
105°C
T
case_min
5°C
TDP
with 1 active memory channel
24.7 W
TDP
with 2 active memory channel
26.4 W
TDP
with 4 active memory channel
30.0 W
Table 3-2. Intel® 5000V Chipset MCH Thermal Specifications
Parameter Value Notes
T
case_max
105°C
T
case_min
5°C
TDP
with 1 active memory channel
23.4 W
TDP
with 2 active memory channel
25.1 W