Intel 5000 Switch User Manual


 
Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 39
Reference Thermal Solution 2
7.5.2 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the chipset MCH.
Figure 7-6 shows the heatsink profile. Appendix A, “Thermal Solution Component
Suppliers” lists a supplier for this extruded heatsink. Other heatsinks with similar
dimensions and increased thermal performance may be available. Full mechanical
drawing of this heatsink is provided in Appendix B, “Mechanical Drawings.”
7.5.3 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.4 Thermal Interface Material
Please refer to Section 6.5.4 for details.
7.5.4.1 Effect of Pressure on TIM Performance
Please refer to Section 7.5.4.1 for details.
7.5.4.2 Heatsink Clip
Please refer to Section 7.5.4.2 for details.
7.5.5 Clip Retention Anchors
Please refer to Section 6.5.6 for details.
7.6 Reliability Guidelines
Please refer to Section 7.6 for details.
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Figure 7-6. Torsional Clip Heatsink Extrusion Profile