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Thermal Specifications
14 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide
Note: These specifications are based on preliminary silicon characterization, however, they
may be updated as further data becomes available.
§
Table 3-3. Intel® 5000X Chipset MCH Thermal Specifications
Parameter Value Notes
T
case_max
105°C
T
case_min
5°C
TDP
with 1 active memory channel
27.3 W
TDP
with 2 active memory channel
29.0 W
TDP
with 4 active memory channel
32.4 W