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Reference Thermal Solution
28 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide
6.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel 5000 Series chipset MCH thermal solution are shown in .
When using heatsinks that extend beyond the chipset MCH reference heatsink envelope
shown in Figure 6-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 2mm (0.07 in.) in height.
6.4 Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are
shown in Figure 6-3 and Figure 6-4. This reference thermal solution has the same hole
patterns as that of the Intel
®
E7500/E7501/E7505 chipset.
Figure 6-2. Tall Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH
TNB
Heatsink
42.30 mm.
42.30 mm.
MCH
Passive
Heatsink
IHS + TIM2
FCBGA + Solder Balls
33.30 mm.
Motherboard
MCH
Passive
Heatsink
4.30 mm.