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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 37
Reference Thermal Solution 2
7.5 Short Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for the chipset MCH is a passive extruded heatsink with
thermal interface. It is attached using a clip with each end hooked through an anchor
soldered to the board. Figure 6-5 shows the reference thermal solution assembly and
associated components. The torsional clip and the clip retention anchor are the same as
the ones used on the Intel
®
E7500/E7501/E7505 chipset reference thermal solution.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B, “Mechanical Drawings.”. Appendix A, “Thermal Solution
Component Suppliers” contains vendor information for each thermal solution
component.
Figure 7-3. Short Torsional Clip Heatsink Board Component Keepout
2x 1.109in.
2x 30.458mm
MCH
60.914mm
2.218in.
2x 12.065mm
2x 5.715mm
2x 0.430in
2x 1.156in
2x 1.591in
0.07" Max Component Height
No Motherboard Component Placement Allowed
Parallel Mean
Air Flow
Direction
42.5 mm
60.00 mm