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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 29
Reference Thermal Solution
6.5 Tall Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for the chipset MCH is a passive extruded heatsink with
thermal interface. It is attached using a clip with each end hooked through an anchor
soldered to the board. Figure 6-5 shows the reference thermal solution assembly and
associated components. The torsional clip and the clip retention anchor are the same as
the one used on the Intel
®
E7500/E7501/E7505 chipset reference thermal solution.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B, “Mechanical Drawings.” Appendix A, “Thermal Solution
Component Suppliers” contains vendor information for each thermal solution
component.
Figure 6-3. Tall Torsional Clip Heatsink Board Component Keepout
2x 1.109in.
2x 1.199in.
MCH
2.398in.
2.218in.
2x 0.475in.
2x 0.225in.
2x 0.430in.
2x 1.156in.
2x 1.591in.
0.07" Max Component Height
No Motherboard Component Placement Allowed
Parallel Mean
Air Flow
Direction