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Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 9
Introduction
T
case_min
Minimum IHS temperature allowed. This temperature is
measured at the geometric center of the top of IHS.
TDP Thermal design power. Thermal solutions should be designed to
dissipate this target power level. TDP is not the maximum power
that the chipset can dissipate.
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
•Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide
•Intel
®
6700PXH 64-bit PCI Hub Datasheet
•Intel
®
631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design
Guidelines
•Intel
®
5000P/5000V/5000Z Chipset Memory Controller Hub (MCH) Datasheet
•Intel
®
5000X Chipset Memory Controller Hub (MCH) Datasheet
• Dual-Core Intel
®
Xeon® Processor 5000 Series Datasheet
• Dual-Core Intel
®
Xeon® Processor 5000 Series Thermal/Mechanical Design
Guidelines
• BGA/OLGA Assembly Development Guide
• Various system thermal design suggestions (http://www.formfactors.org)
Note: Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.
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