Filter
Top Products
Chapter 2 System Overview
Compaq iPAQ Family of Internet Devices
First Edition – March 2000
2-10
2.4.1 PROCESSORS
The Compaq iPAQ family includes models based on Celeron and Pentium III processors. These
processors are backward-compatible with software written for the Pentium II, Pentium MMX,
Pentium Pro, Pentium, and x86 microprocessors. Both processor architectures include a floating-
point unit and first and secondary caches providing enhanced performance for multimedia
applications.
2.4.1.1 Celeron Processor
Select Compaq iPAQ systems use the Intel Celeron processor. The Celeron processor provides
economical performance and is compatible with software written for previous generation
processors such as Pentium II, Pentium MMX, Pentium, and x86 processors. Featuring a
Pentium-type core architecture, the Celeron processor integrates a dual-ALU CPU with a
floating-point unit, 32-KB first-level cache, and 128-KB second level cache, all of which operate
at full processing (CPU) speed. The Celeron processor includes MMX technology for enhanced
multimedia performance.
The Celeron processor uses a PGA370 package with a heat sink.
2.4.1.2 Pentium III Processor
The Intel Pentium III processor used on select systems represents the maximum performance
processor for Compaq iPAQs. The Pentium III processor is compatible with software written for
Celeron, Pentium II, Pentium MMX, Pentium, and x86 processors.
The Pentium III processor core integrates a dual-ALU CPU with a floating-point unit and 32-KB
first-level cache operating at processing (CPU) speed. Featuring .18-micron technology, the
Pentium III processor features 256 kilobytes of secondary cache included on the CPU die and
operating at full processor speed.
The Pentium III processor includes MMX technology for enhanced multimedia performance.
Also included are 70 additional streaming SIMD extensions (SSE) for enhancing 3D graphics
and speech processing performance and a serial number function useful for asset tracking.
The Pentium III processor employed in these systems uses a Flip-Chip (FC) PGA370 package
and heat sink.