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Technical Reference Guide
Compaq iPAQ Family of Internet Devices
First Edition - March 2000
2-11
2.4.1.3 Processor Upgrading
All models of the Compaq iPAQ use the PGA370 zero-insertion force (ZIF) socket for processor
mounting as shown in Figure 2-7. Raising the Lock/Unlock handle of the socket in the vertical
position allows the processor to be removed or inserted into the socket. Lowering the
Lock/Unlock handle in the down (horizontal) position locks the processor in place. Factory
configurations use processors fitted with passive heat sinks. Upgrade (boxed) processors may be
fitted with a heat sink/fan assembly with a power cable that attaches to the fan power header
provided on the system board.
Figure 2–7.
Processor Assembly and Mounting
The processor clock frequency is automatically set by chipset logic, eliminating the need for
setting DIP switches when upgrading the processor.
WARNING:
The system board is designed handle a maximum processor current load
of 18 amps. Installing a replacement processor that draws more than 18 amps of current
may damage the processor and/or the system board.
!
Heat Sink
Processor
PPGA370
Socket
Heat Sink
Retaining Clip
Lock/Unlock
Handle