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CY7C63310, CY7C638xx
Document 38-08035 Rev. *K Page 5 of 83
Figure 5-2. CY7C63823 Die Form
Die step = 1792.98 μm x 2272.998 μm
Die size = 1727 μm x 2187 μm
Bond pad opening = 70 μm x 70 μm
Die thickness = 14 mils
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Table 5-1. Die Pad Summary
Pad Number Pad Name X (microns) Y (microns)
1 P0.7 -742.730 911.990
2 P0.6 -755.060 792.200
3 P0.5 -755.060 699.300
4 P0.4 -755.060 606.400
5 P0.3 -755.060 -430.080
6 P0.2 -755.060 -522.980
7 P0.1 -755.060 -618.830
8 P0.0 CLKIN -755.060 -714.020
9 P2.1 -755.060 -810.220
10 P2.0 -393.580 -977.930
11 VSS 537.500 -964.700
12 PI.0 D+ 736.110 -936.680
13 P1.1 D– 736.110 -625.130
14 VDD 736.110 -260.670
15 P1.2 VREG 736.110 53.800
16 P1.3 723.510 336.780
17 P3.0 723.510 438.690
18 P3.1 723.510 532.880
19 P1.4 723.510 635.310
20 P1.5 SMOSI 723.510 728.220
21 P1.6 SMISO 723.510 839.290
22 P1.7 696.630 1008.480
23 Reserved -795.400 1023.270
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