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Document 38-08035 Rev. *K Page 76 of 83
31. Package Diagrams
Figure 31-1. 16-Pin (300-Mil) Molded DIP P1
Figure 31-2. 16-Pin (150-Mil) SOIC S16.15
DIMENSIONS IN INCHES
MIN.
MAX.
SEATING PLANE
0.240
0.260
0.015
0.035
0.740
0.770
0.120
0.140
0.015
0.060
0.015
0.020
0.055
0.065
0.140
0.190
0.090
0.110
0.280
0.325
0.009
0.012
0.310
0.385
0.115
0.160
3° MIN.
18
916
51-85009 *A
PIN 1ID
0°~8°
18
916
SEATING PLANE
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
DIMENSIONS IN INCHES[MM] MIN.
MAX.
0.016[0.406]
0.010[0.254]
X45°
0.004[0.102]
REFERENCE JEDEC MS-012
PART #
S16.15 STANDARDPKG.
SZ16.15 LEAD FREE PKG.
PACKAGE WEIGHT 0.15gms
51-85068-*B
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