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S1F70000 SeriesEPSON 6–11
Technical Manual
Appendix
Appendix
TAPING INFORMATION
The emboss carrier taping standard is shown in the
following table and figure. This standard conforms to
Dimension code Dimensions (mm/°)
P2 2.0 ±0.1
T 0.3 ±0.05
T2 3.0
W 16.0 ±0.3
W1 13.5
blanks. This does not apply to the tape leader and
trailer.
Dimension code Dimensions (mm/°)
A 8.4
B 10.6
D0 1.55 ±0.05
D1 1.55 ±0.05
E 1.75 ±0.1
F 7.5 ±0.1
P1 12 ±0.1
P0 4.0 ±0.1
Note
The tape thickness is 0.1 mm Max.
There are no joints in either the cover or carrier tapes.
Less than 0.1% of the total device count is comprised
of non-sequential blanks. There are no sequential
the EIAJ RCI009B electronic parts taping specification.
Each tape holds 2,000 devices.
DIA D0
DIA D1
P0
W1
T2
P2
E
T
W
P1
W
F
A
B
EMBOSS CARRIER TAPING STANDARD (SOP5-14pin )