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S1F76640 Series
2–42 EPSON S1F70000 Series
Technical Manual
Chip External Shape
Figure 4-4 Pad Assignments
(x) (y) (t)
Chip size : 2.30mm × 2.60mm × 0.30mm
PAD aperture : 100µm × 100µm
DIE number : F76640D0A0
Pad Center Coordinates
S1F7664D0A0
Pad Pad Center Coordinates
No. Name X[µm] Y[µm]
1 RV –984.0 1096.0
2VREG 788.0
3 (TESTOUT) 580.0
4 TC1 390.0
5 TC2 96.0
6POFF –218.0
7 GND –510.0
8 OSC1 –802.0
9OSC2 –1094.0
10 VDD –1134.0
11 CAP1– –892.0
12 CAP1+ –514.0
13 CAP2– 182.0
14 CAP2+ 372.0
15 CAP3+ 750.0
16 VO 942.0
17 VRI 1134.0
+
(0,0)
Y
X
2.30mm
2.60mm
CHIP EXTERNAL SHAPE AND PAD CENTER COORDINATES
984.0