Disclaimer
Information in this document is provided in connection with Intel
®
products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating
to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability,
or infringement of any patent, copyright or other intellectual property right. Intel products are not designed, intended or
authorized for use in any medical, life saving, or life sustaining applications or for any other application in which the failure of
the Intel product could create a situation where personal injury or death may occur. Intel may make changes to
specifications and product descriptions at any time, without notice.
Intel server boards contain a number of high-density VLSI and power delivery components that need adequate airflow for
cooling. Intel’s own chassis are designed and tested to meet the intended thermal requirements of these components when
the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel
developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow
required for their specific application and environmental conditions. Intel Corporation can not be held responsible if
components fail or the server board does not operate correctly when used outside any of their published operating or non-
operating limits.
Intel, Intel Pentium, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2005, Intel Corporation. All Rights Reserved