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MSP-TS430PZ100USB
Table B-25. MSP-TS430PZ5x100 Bill of Materials
No. per
Pos. Ref Des Description DigiKey Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only
1b C3, C4 47pF, SMD0805 recommendation. Check
your crystal spec.
2 C6, C7 2 10uF/10V, Tantal Size B 511-1463-2-ND
C5, C10,
C11,
3 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14
C12,C13,
C14
4 C8 0 2.2nF, SMD0805 DNP
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 67-1553-1-ND
DNP: headers and
receptacles enclosed with
J1, J2, J3, "SAM1029-25-
7 0 25-pin header, TH kit. Keep vias free of
J4 NDSAM1213-25-ND"
solder.: Header:
Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
JP5, JP6,
JP7,
9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP8,JP9,
JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
Place on JP1, JP2, JP3,
12 9 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9,
JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of
14 BOOTST 0 10-pin connector, male, TH
solder
Q1: Micro Crystal
DNP: Keep vias free of
15 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8, R9, DNP: R6, R8, R9, R10,
17 3 0 Ω, SMD0805 541-000ATR-ND
R10, R11, R11, R12
R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
20 PCB 1 90 x 82 mm 2 layers
Rubber Apply to corners at bottom
21 4 Select appropriate
standoff side
DNP: Enclosed with kit
22 MSP430 2 MSP430F5438IPZ
supplied by TI
B.25 MSP-TS430PZ100USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
107
SLAU278F–May 2009–Revised December 2010 Hardware
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