MSP-TS430QFN23x0
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Table B-10. MSP-TS430QFN23x0 Bill of Materials
No. per
Pos. Ref Des Description DigiKey Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3 1 10uF/10V, Tantal Size B 511-1463-2-ND
3 C4 1 100nF, SMD0805 478-3351-2-ND
4 C5 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: headers and
receptacles enclosed with
J1, J2, J3, SAM1034-10-NDSAM1212-
6 0 10-pin header, TH kit.Keep vias free of
J4 10-ND
solder.: Header:
Receptacle
Place jumper on header
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND
JP1; Pos 1-2.
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of
11 BOOTST 0 10-pin connector, male, TH
solder
Micro Crystal MS1V-T1K
DNP: Keep vias free of
12 Q1 0 Crystal 32.768kHz, C(Load) =
solder
12.5pF
13 R1 1 330 Ω, SMD0805 541-330ATR-ND
14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
17 PCB 1 79 x 66 mm 2 layers
Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom
18 4 ~6mm width, 2mm height
Plastic feet SJ-5302 side
DNP: enclosed with kit
19 MSP430 2 MSP430F2370IRHA
supplied by TI
60
Hardware SLAU278F–May 2009–Revised December 2010
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