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MSP-TS430RSB40
Table B-11. MSP-TS430RSB40 Bill of Materials
No. Per
Pos. Ref Des Description DigiKey Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
C3, C7, C10,
2 3 10uF/10V, SMD 0805 445-1371-1-ND DNP C12
C12
C4, C6, C8,
3 3 100nF, SMD0805 311-1245-2-ND DNP C11
C11
4 C5 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND
DNP: headers and
receptacles enclosed with kit.
7 J1, J2, J3, J4 4 10-pin header, TH
Keep vias free of solder. :
Header : Receptacle
DNP: headers and
receptacles enclosed with kit.
7.1 4 10-pin header, TH
Keep vias free of solder. :
Header : Receptacle
JP1,
JP4,JP5,
Jumper: 1-2 on JP1, JP10;
8 JP6, JP7, 9 3-pin header, male, TH SAM1035-03-ND
2-3 on JP4-JP9
JP8, JP9, J5,
JP10
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP. Keep vias free of
11 BOOTST 0 10-pin connector, male, TH
solder
QFN-40B-0.4_
12 U1 1 Enplas
ENPLAS_SOCKET
Micro Crystal MS3V-T1R
DNP: Q1. Keep vias free of
13 Q1 0 Crystal 32.768kHz, C(Load) =
solder
12.5pF
Place on: JP1, JP2, JP3,
15 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,
JP9, JP10
16 R1,R7 2 330R SMD0805
R2, R3, R5,
17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6
R10
18 R4 1 47k SMD0805
DNP: enclosed with kit. Is
19 MSP430 2 MSP430F5132
supplied by TI
Rubber stand select appropriate; e.g., apply to corners at bottom
20 4
off Buerklin: 20H1724 side
63
SLAU278F–May 2009–Revised December 2010 Hardware
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