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MSP-TS430PM64
Table B-15. MSP-TS430PM64 Bill of Materials
No. per
Pos. Ref Des Description DigiKey Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only
1.1 C3, C4 0 47pF, SMD0805 recommendation. Check
your crystal spec.
2 C6, C7 1 10uF/10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
DNP: Headers and
receptacles enclosed with
J1, J2, J3, SAM1029-16-NDSAM1213-
7 0 16-pin header, TH kit.Keep vias free of
J4 16-ND
solder.: Header:
Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 2 Jumper 15-38-1024-ND Place on: J6, J7
12 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of
13 BOOTST 0 10-pin connector, male, TH
solder
Q1: Micro Crystal
DNP: Keep vias free of
14 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
15 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R7, R8,
DNP: R4, R6, R7, R9, R10,
16 R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND
R11, R12, R13, R14
R11, R12,
R13, R14
17 R5 1 47k Ω, SMD0805 541-47000ATR-ND
18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
19 PCB 1 78 x 75 mm 2 layers
Rubber Apply to corners at bottom
20 4 select appropriate
standoff side
MSP430F2619IPM DNP: Enclosed with kit
21 MSP430 22
MSP430F417IPM supplied by TI
75
SLAU278F–May 2009–Revised December 2010 Hardware
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