Filter
Top Products
www.ti.com
MSP-TS430PW28
Table B-7. MSP-TS430PW28 Bill of Materials
(1)
No. per
Pos. Ref Des Description DigiKey Part No. Comment
Board
DNP: C1, C2 , Cover holes
1 C1, C2 0 12pF, SMD0805
while soldering
2 C3 1 10uF/10V Tantal Elko B
3 C4 1 100nF, SMD0805
4 C5 0 2.2nF, SMD0805 DNP
5 D1 1 LED green SMD0603
Micro Crystal MS1V-T1K DNP: Cover holes and
6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while
12.5pF soldering
DNP: Headers and
receptacles enclosed with
7 J1, J2 2 14-pin header, TH male kit.Keep vias free of
solder.: Header:
Receptacle
DNP: headers and
receptacles enclosed with
7.1 2 14-pin header, TH female kit.Keep vias free of
solder.: Header:
Receptacle
8 J5, IP1 1 3-Pin Connector , male
JP1, JP4,
JP5, JP6,
8a 7 3-Pin Connector , male Jumper on Pos 1-2
JP7, JP8,
JP9
9 JP2, JP3 2 2-Pin Connector , male with Jumper
DNP: Cover holes while
10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115
soldering
11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121
12 R1, R7 2 330R, SMD0805
R2, R3, R5,
12 0 0R, SMD0805 DNP
R6
14 R4 1 47K, SMD0805
15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01
(1)
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
51
SLAU278F–May 2009–Revised December 2010 Hardware
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated