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MVME55006E Single-Board Computer Installation and Use (6806800A37D)
99
B Thermal Validation
B.1 Overview
Board component temperatures are affected by ambient temperature, air flow, board electrical
operation and software operation. In order to evaluate the thermal performance of a circuit
board assembly, it is necessary to test the board under actual operating conditions. These
operating conditions vary depending on system design.
While Emerson performs thermal analysis in a representative system to verify operation within
specified ranges, refer to Appendix A, Specifications, you should evaluate the thermal
performance of the board in your application.
This appendix provides systems integrators with information which can be used to conduct
thermal evaluations of the board in their specific system configuration. It identifies thermally
significant components and lists the corresponding maximum allowable component operating
temperatures. It also provides example procedures for component-level temperature
measurements.
B.2 Thermally Significant Components
The following table summarizes components that exhibit significant temperature rises. These
are the components that should be monitored in order to assess thermal performance. The
table also supplies the component reference designator and the maximum allowable operating
temperature.
You can find components on the board by their reference designators as shown in Figure B-2
and Figure B-1. Versions of the board that are not fully populated may not contain some of these
components.
The preferred measurement location for a component may be junction, case, or air as specified
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the component.
Air temperature refers to the ambient temperature near the component.
Table B-1 Thermally Significant Components
Reference
Designator Generic Description
Max. Allowable
Component
Temperature
(deg. C)
Measurement
Location
U2, U3 Flash, soldered 85 Ambient
U16 Gigabit Ethernet 119 Case
U22 System controller 110 Case
U24 MPC7457 processor 103 Case