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21264/EV68A Hardware Reference Manual
Thermal Management 10–1
10
Thermal Management
This chapter describes the 21264/EV68A thermal management and thermal design
considerations, and is organized as follows:
• Operating temperature
• Heat sink specifications
• Thermal design considerations
10.1 Operating Temperature
The 21264/EV68A is specified to operate when the temperature at the center of the heat
sink (T
c)
is as shown in Table 10–1. Temperature T
c
should be measured at the center of
the heat sink, between the two package studs. The GRAFOIL pad is the interface mate-
rial between the package and the heat sink.
Note: Compaq recommends using the heat sink because it reduces overheating
that causes thermal failure.
Table 10–1 Operating Temperature at Heat Sink Center (T
c
)
T
c
Frequency
80.8° C750MHz
78.6° C833MHz
77.6° C875MHz
76.0° C940MHz