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Cisco CRS-1 Carrier Routing System 16-Slot Multishelf System Site Planning Guide
OL-7422-04
Chapter 2 16-Slot Fabric Card Chassis Installation Site Requirements
Chassis Cabling Requirements
• Leave the dust covers on optical cables and connectors until you are ready to plug the cable into its
optical connector. For example, leave the dust covers on the optical array cables as you route the
cables between the chassis. If the dust cover was removed earlier from an optical cable or connector,
be sure to clean the optics on the cable or connector before using it.
• Reattach the dust covers on optical cables and connectors when they are not being used.
• Remove the dust covers from optical cables and corresponding optical connectors, one at a time, as
you are ready to plug the cable into the connector. Do not remove all of the covers from a group of
cables or connectors before plugging the cables into the connectors; otherwise, the optics can
become contaminated.
Note Be sure to save the dust covers you remove from optical cables and connectors and store
them in a clean area. Reattach the dust cover when you unplug a cable from its connector.
• The optical interconnect modules (OIMs) in the fabric card chassis, have dust covers on the
high-density backplane mounted trunk (HBMT) connectors that the S2 fabric cards plug into.
Remove the dust covers on the HBMT connectors before installing the OIM into the chassis. The
connectors have spring-loaded doors to protect the optics from contamination.
• Leave the dust covers on the optical connectors on fabric cards until you are ready to use the
connector. In addition, remove the dust covers one at a time as you are ready to use each connector.
–
On an S13 fabric card (in the line card chassis), leave the dust covers on the optical connectors
until you are ready to plug a chassis interconnect (trunk) cable into the connector.
–
On an S2 fabric card (in the fabric card chassis), leave the dust covers on the optical connectors
until you are ready to plug the fabric card into the OIM.