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TMS320C6712D
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
SPRS293A − OCTOBER 2005 − REVISED NOVEMBER 2005
38
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
device and development-support tool nomenclature (continued)
PREFIX
DEVICE SPEED RANGE
TMS 320 C 6712D GDP 150
DEVICE FAMILY
TECHNOLOGY
PACKAGE TYPE
†‡§
C = CMOS
DEVICE
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
( )
Blank = 0°C to 90°C, commercial temperature
A = −40°C to 105°C, extended temperature
150 MHz
TMX= Experimental device
TMP= Prototype device
TMS= Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
GDP = 272-pin plastic BGA
ZDP = 272-pin plastic BGA, with Pb-free soldered balls
†
BGA = Ball Grid Array
QFP = Quad Flatpack
‡
The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package devices are
supported in the same speed grades as the GDP package devices (available upon request).
§
For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the TI website
(www.ti.com).
32 or 320 = TMS320 DSP family
C6712D
Figure 5. TMS320C6000 DSP Platform Device Nomenclature (Including the TMS320C6712D Device)
MicroStar BGA and PowerPAD are trademarks of Texas Instruments.