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TMS320C6712D
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
SPRS293 − OCTOBER 2005
98
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
MECHANICAL DATA
package thermal resistance characteristics
The following tables show the thermal resistance characteristics for the GDP and ZDP mechanical packages.
thermal resistance characteristics (S-PBGA package) for GDP
NO °C/W Air Flow (m/s)
†
Two Signals, Two Planes (4-Layer Board)
1 RΘ
JC
Junction-to-case 9.7 N/A
2 Psi
JT
Junction-to-package top 1.5 0.0
3 RΘ
JB
Junction-to-board 19 N/A
4 RΘ
JA
Junction-to-free air 22 0.0
5 RΘ
JA
Junction-to-free air 21 0.5
6 RΘ
JA
Junction-to-free air 20 1.0
7 RΘ
JA
Junction-to-free air 19 2.0
8 RΘ
JA
Junction-to-free air 18 4.0
9 Psi
JB
Junction-to-board 16 0.0
†
m/s = meters per second
thermal resistance characteristics (S-PBGA package) for ZDP
NO °C/W Air Flow (m/s)
†
Two Signals, Two Planes (4-Layer Board)
1 RΘ
JC
Junction-to-case 9.7 N/A
2 Psi
JT
Junction-to-package top 1.5 0.0
3 RΘ
JB
Junction-to-board 19 N/A
4 RΘ
JA
Junction-to-free air 22 0.0
5 RΘ
JA
Junction-to-free air 21 0.5
6 RΘ
JA
Junction-to-free air 20 1.0
7 RΘ
JA
Junction-to-free air 19 2.0
8 RΘ
JA
Junction-to-free air 18 4.0
9 Psi
JB
Junction-to-board 16 0.0
†
m/s = meters per second
packaging information
The following packaging information and addendum reflect the most current released data available for the
designated device(s). This data is subject to change without notice and without revision of this document.