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ROC827 Instruction Manual
Issued Mar-06 General Information 1-4
Figure 1-2 shows a typical expanded backplane (EXP) populated with a
full complement of six I/O modules. Each EXP is composed of the same
plastic housing as the ROC827, contains six I/O slots, and has a powered
backplane that easily attaches to the ROC827 and other EXPs.
Figure 1-2. ROC827 with One Expanded Backplane
The ROC827 and EXPs support nine types of Input/Output (I/O) modules,
which can satisfy a wide variety of field I/O requirements (refer to Chapter
4, Input/Output Modules). I/O modules include:
Analog Inputs (AI).
Analog Outputs (AO).
Discrete Inputs (DI).
Discrete Outputs (DO).
Digital Relay Outputs (DOR).
HART Inputs/Outputs.
Pulse Inputs (PI) – High/Low Speed.
Resistance Temperature Detector Inputs (RTD).
J and K Type Thermocouple (T/C) Inputs.