Emerson ROC827 Network Card User Manual


 
ROC827 Instruction Manual
Issued Mar-06 General Information 1-2
Chapter 2
Installation and Use
Provides information on installation, tools, wiring,
mounting the ROC827, and other essential elements of
the ROC827 and EXPs.
Chapter 3
Power Connections
Provides information on the Power Input modules
available for the ROC827 and EXPs and provides
worksheets to help determine power requirements for
the ROC827 configurations.
Chapter 4
Input/Output (I/O)
Modules
Provides information for the Input/Output (I/O) modules
available for the ROC827 and EXPs.
Chapter 5
Communications
Provides information for the built-in communications
and the optional communication modules available for
the ROC827.
Chapter 6
Troubleshooting
Provides information on diagnosing and correcting
problems for the ROC827.
Chapter 7
Calibration
Provides information for calibrating Analog Inputs,
HART Inputs, RTD Inputs, and MVS Inputs for the
ROC827.
Glossary Provides definitions of acronyms and terms.
Index
Provides an alphabetic listing of items and topics
contained in this manual.
1.2 Hardware
The ROC827 is highly innovative and versatile with an integrated
backplane to which the central processor unit (CPU), Power Input module,
communication modules, and I/O modules connect. The ROC827 has
three I/O module slots.
The ROC800-Series expanded backplane (EXP) attaches to the ROC827.
Each EXP provides six additional I/O module slots. The ROC827 can
support up to four EXPs, for a total of 27 I/O module slots in a fully
configured ROC827 (six slots per EXP plus the three I/O slots on the
ROC827 itself).
The ROC827 uses a Power Input module to convert external input power
to the voltage levels required by the ROC827’s electronics and to monitor
voltage levels to ensure proper operation. Two Power Input modules—12
Volts dc (PM-12) and 24 Volts dc (PM-24)—are available for the
ROC827. For more information on the Power Input modules, refer to
Chapter 3, Power Connections.
The ROC827 supports a variety of communication protocols: ROC Plus,
Modbus, Modbus TCP/IP, Modbus encapsulated in TCP/IP, and Modbus
with Electronic Flow Measurement (EFM) extensions.
Figure 1-1 shows the housing, typical I/O modules, and communication
modules installed in a ROC827. The patented ABS (Acrylonitrile
Butadiene Styrene) plastic housing has wire covers to protect the wiring
terminals. The housing includes DIN rail mounts for mounting the
ROC827 on a panel or in a user-supplied enclosure.