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Thermal Management Specifications
112 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
5.1.3.4 6-Core 130W 1S WS Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on final silicon characterization.
4. Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
100 78.5 90.0 93.4
105 79.6 91.7 95.2
110 80.7 93.3 97.1
115 81.8 95.0 98.9
120 82.9 96.7 100.7
125 84.0 98.3 102.6
130 85.0 100.0 104.4
Table 5-8. Tcase: 6-Core 130W 1S WS Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 130 5 See Figure 5-8 and
Table 5-9
1, 2, 3, 4, 5
Table 5-7. 8/6-Core 130W Thermal Profile Table 1U (Sheet 2 of 2)
Power (W)
Maximum T
CASE
(°C) Maximum DTS (°C)
8/6-core 8-core 6-Core
Figure 5-8. Tcase: 6-Core 130W 1S WS Thermal Profile