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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families 135
Datasheet Volume One
Thermal Management Specifications
5.1.4.2 8-Core LV70W Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on initial final silicon simulations, which will be updated as further
characterization data becomes available.
4. Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
65 66.6 81.6 74 89
70 67.7 82.7 75 90
75 68.7 83.7 77 92
80 69.8 84.8 79 94
85 70.9 85.9 80 95
90 72.0 87.0 82 97
95 73.0 88.0 84 99
Table 5-29. Tcase: 8-Core LV70W Thermal Specifications, Embedded Server SKU
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 70 5 See Figure 5-30 and Table 5-30 1, 2, 3, 4, 5
Table 5-28. 8-Core LV95W Thermal Profiles, Embedded Server SKU (Sheet 2 of 2)
Maximum T
CASE
(ºC)
Maximum DTS (ºC)
Power (W)
Long Term Short Term Long Term Short Term
Figure 5-30. Tcase: 8-Core LV70W Thermal Profile, Embedded Server SKU