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Thermal Management Specifications
116 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
3. Refer to the
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical
Design Guide
for system and environmental implementation details.
5.1.3.6 8/6-Core 95W Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on final silicon characterization.
4. Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 5-11. 8-Core 115W Thermal Profile Table 1U
Power (W) Maximum T
CASE
(°C) Maximum DTS (°C)
0 55.0 55.0
5 56.1 56.7
10 57.2 58.3
15 58.3 60.0
20 59.3 61.7
25 60.4 63.3
30 61.5 65.0
35 62.6 66.7
40 63.7 68.3
45 64.8 69.3
50 65.9 71.7
55 66.9 73.3
60 68.0 75.0
65 69.1 76.6
70 70.2 78.3
75 71.3 80.0
80 72.4 81.6
85 73.4 83.3
90 74.5 85.0
95 75.6 86.6
100 76.7 88.3
105 77.8 90.0
110 78.9 91.6
115 80.0 93.3
Table 5-12. Tcase: 8/6-Core 95W Thermal Specifications, Workstation/Server Platform
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 95 5 See Figure 5-12 and Table 5-13 1, 2, 3, 4, 5