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Intel® Server Board SE7320SP2 & Intel Server Board SE7525GP2 TPS General Specifications
Revision 2.0
164
8. General Specifications
8.1 Absolute Maximum Ratings
Operating an Intel Server Board SE7320SP2 / Intel Server Board SE7525GP2 at conditions
beyond those shown in the following table may cause permanent damage to the system. The
table is provided for stress testing purposes only. Exposure to absolute maximum rating
conditions for extended periods may affect system reliability.
Table 97. Absolute Maximum Ratings
Operating Temperature 0 degrees C to 55 degrees C
Non-operating Temperature -40 degrees C to +70 degrees C
Voltage on any signal with respect to ground -0.3 V to Vdd + 0.3V
3.3 V Supply Voltage with Respect to ground -0.3 V to 3.63 V
5 V Supply Voltage with Respect to ground -0.3 V to 5.5 V
Notes:
1. Chassis design must provide proper airflow to avoid exceeding Intel Xeon processor maximum
case temperature.
2. VDD means supply voltage for the device
Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery
components which need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation can
not be held responsible, if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
8.2 Mean Time Between Failure (MTBF)
Intel has calculated the MTBF for the Intel Server Board SE7320SP2 and Intel Server Board
SE7525GP2 to be as follows:
Table 98. MTBF calculation
Ambient Temperature MTBF Calculation
55° C 97,164
40° C 108,598
8.3 Processor Power Support
The Intel Server Boards SE7320SP2 and SE7525GP2 are designed to support the Thermal
Design Point (TDP) guideline for Intel
®
Xeon™ processors. In addition, the Flexible
Motherboard Guidelines (FMB) have been followed to help determine the suggested thermal
and current design values for anticipating future processor needs. Table 99 provides maximum
values for Icc, TDP power and T
CASE
for the Intel Xeon processor family.