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Intel® Server Board SE7320SP2 & Intel Server Board SE7525GP2 TPS Functional Architecture
Revision 2.0
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3.1.5 Common Enabling Kit (CEK) Design Support
The server board has been designed to comply with Intel’s Common Enabling Kit (CEK)
processor mounting and heat sink retention solution. The server board will ship with a CEK
spring snapped onto the bottom side of the board beneath each processor socket. The CEK
spring is removable, allowing for the use of non-Intel heat sink retention solutions.
Figure 5. CEK Processor Mounting
3.1.6 Processor Support
The server board SE7320SP2 and the server board SE7525GP2 are designed to support one
or two Intel
®
Xeon™ processors utilizing an 800MHz Front Side Bus with frequencies starting at
2.8 GHz. Previous generations of Intel Xeon processors are not supported on either of these
server boards.
The server board is designed to provide current up to 120A per processors. Processors with
higher current requirements are not supported.
Note: Only Intel
®
Xeon™ processors that support an 800MHz Front Side Bus are supported on
the server board SE7320SP2 and server board SE7525GP2. See the table below for the
supported processors.
Heatsink assembly with
integrated hardware
Thermal Interface
Material (TIM)
Server board
CEK Spring
Chassis