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Chapter 2 - Hardware Installation
2-26
MGC+50 Hardware Installation
Unpacking and Positioning the MGC+50
To unpack and position the MGC+50:
1. When you receive your MGC+50, inspect the equipment for damage and
verify that the components match the packing slip. If you did not receive
a component or if there is damage to the system, notify Polycom
immediately.
Figure 2-12: MGC+50 package
2. Place the MGC+50 unit on a stable flat surface in a location that meets
the MGC+50’s environment requirements, which are:
— Operating temperature: 10°–40°C (50°–104°F)
— Humidity: 15%–90% noncondensing
— Altitude: Up to 3,000m (10,000ft)
— ESD: +8 kV
Carrying Strap
Lock in Open Position
Wood Packing Case
Lock in Closed Position