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Intel® Server Platform SR6850HW4 TPS Table of Contents
Revision 1.0
Intel order number D23151-001
iii
Table of Contents
1. Product Overview.................................................................................................................1
2. System Overview..................................................................................................................3
2.1 System Feature Overview........................................................................................3
2.2 Introduction..............................................................................................................4
2.3 External Chassis Features - Front...........................................................................8
2.3.1 Front Control Panel..................................................................................................8
2.3.2 Hot-swap Hard Disk Drive and Peripheral Device Bays ..........................................9
2.4 External Chassis Features - Rear..........................................................................10
2.5 Internal Chassis Features......................................................................................11
2.5.1 Server Board Set SE8500HW4 Mainboard............................................................11
2.5.2 Server Board Set SE8500HW4 Memory Board.....................................................12
2.5.3 Power Distribution Board.......................................................................................12
2.5.4 SCSI Backplane Board Board ...............................................................................12
2.5.5 Front Panel I/O Board............................................................................................13
2.5.6 Front Panel Control Board.....................................................................................13
2.5.7 SATA-to-IDE Converter Board...............................................................................13
2.5.8 Intel® Management Module...................................................................................13
2.5.9 Fibre Channel Module ...........................................................................................14
2.5.10 RAID On Motherboard (ROMB).............................................................................14
2.5.11 Power Supply Module............................................................................................14
2.5.12 Cooling Subsystem................................................................................................16
2.6 New Platform Features ..........................................................................................16
2.6.1 Advanced Memory Performance and Protection ...................................................16
2.6.2 Rolling BIOS ..........................................................................................................17
2.7 Server Management ..............................................................................................17
2.7.1 Intel Management Module (IMM)...........................................................................17
2.7.2 Hot Swap Controller...............................................................................................19
2.8 Reliability, Availability, Serviceability, Usability, Manageability (RASUM) .............19
2.9 Expansion Support ................................................................................................20
2.10 Specifications.........................................................................................................21
2.10.1 Environmental Specifications Summary ................................................................21
2.10.2 Physical Specifications .......................................................................................... 22