Samsung KFN8GH6Q4M Computer Drive User Manual


 
Flex-MuxOneNAND4G(KFM4GH6Q4M-DEBx)
- 112 -
FLASH MEMORY
Flex-MuxOneNAND8G(KFN8GH6Q4M-DEBx)
Flex-MuxOneNAND16G(KFKAGH6Q4M-DEBx)
5.5 AC Characteristics for Asynchronous Read
See Timing Diagrams 6.3 and 6.4.
NOTE :
1) If OE
is disabled at the same time or before CE is disabled, the output will go to high-z by tOEZ.
If CE
is disabled at the same time or before OE is disabled, the output will go to high-z by tCEZ.
If CE
and OE are disabled at the same time, the output will go to high-z by tOEZ.
These parameters are not 100% tested.
2) This Parameter is valid at toggle bit timing in asynchronous read only. (timing diagram 6.20 and 6.21)
5.6 AC Characteristics for Warm Reset (RP), Hot Reset and NAND Flash Core Reset
See Timing Diagrams 6.16, 6.17 and 6.18.
NOTE :
1) These parameters are tested based on INT bit of interrupt register. Because the time on INT pin is related to the pull-up and pull-down resistor value.
2) The device may reset if tRP < tRP min(200ns), but this is not guaranteed.
Parameter Symbol
KFM4GH6Q4M/
KFN8GH6Q4M/
KFKAGH6Q4M(TBD)
Unit
Min Max
Access Time from CE
Low tCE -76ns
Asynchronous Access Time from AVD
Low tAA -76ns
Asynchronous Access Time from address valid t
ACC -76ns
Read Cycle Time t
RC 76 - ns
AVD
Low Time tAVDP 12 - ns
Address Setup to rising edge of AVD
tAAVDS 5-ns
Address Hold from rising edge of AVD
tAAVDH 6-ns
Output Enable to Output Valid t
OE -20ns
CE
Setup to AVD falling edge tCA 0-ns
CE
Disable to Output & RDY High Z
1)
tCEZ -20ns
OE
Disable to Output High Z
1)
tOEZ -15ns
AVD
High to OE Low tAVDO 0-ns
CE
Low to RDY Valid tCER -15ns
WE Disable to AVD Enable
tWEA 15 - ns
Address to OE low
tASO
2)
10 - ns
Parameter Symbol Min Max Unit
RP & Reset Command Latch to BootRAM Access
tReady1
(BufferRAM)
-5
s
RP
& Reset Command Latch(During Load Routines) to INT High (Note1)
tReady2
(NAND Flash Array)
-10
s
RP
& Reset Command Latch(During Program Routines) to INT High (Note1)
tReady2
(NAND Flash Array)
-20
s
RP
& Reset Command Latch(During Erase Routines) to INT High (Note1)
tReady2
(NAND Flash Array)
- 150
s
RP
& Reset Command Latch(NOT During Internal Routines) to INT High (Note1)
tReady2
(NAND Flash Array)
-10
s
RP
Pulse Width (Note2)
tRP
200 -
ns