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Design and Environmental Specifications IntelP®P Server Board S3420GP TPS
9.3.1 Processor Power Support
The server board supports the Thermal Design Power (TDP) guideline for Intel
®
Xeon
®
processor. The Flexible Motherboard Guidelines (FMB) were also followed to help determine
the suggested thermal and current design values for anticipating future processor needs. The
following table provides maximum values for Icc, TDP power and T
CASE
for the Intel
®
Xeon
®
3400 Series processor.
Table 56. Intel
®
Xeon
®
Processor TDP Guidelines
TDP Power Maximum T
CASE
Icc Maximum
95 W 67.0º C 150 A
9.4 Power Supply Output Requirements
This section is for reference purposes only. The intent is to provide guidance to system
designers to determine a power supply for use with this server board. This section specifies the
power supply requirements Intel used to develop a power supply for the Intel
®
Server System
SR1630GP and SR1630HGP.
The following tables define two power and current ratings for this 350-W power supply. The
combined output power of all outputs should not exceed the rated output power. The power
supply must meet both static and dynamic voltage regulation requirements for the minimum
loading conditions.
Table 57. 350-W Load Ratings
Voltage Minimum Continuous Maximum Continuous Peak
+3.3 V 0.2A 14 A
+5 V 1.0 A 18A
+12 V 1.5A 24 A 28A
-12 V 0A 0.3A
+5 VSB 0.1 A 2.0 A 2.5 A
1. Notes:
1. Maximum continuous total DC output power should not exceed 350 W.
2. Peak total DC output power should not exceed 400 W.
3. Peak power and peak current loading should be supported for a minimum of 12 seconds.
4. Combined 3.3 V/5 V power should not exceed 100 W.
Revision 1.0
Intel order number E65697-003
88