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Intel NetStructure
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MPCBL0001 High Performance Single Board Computer 5
Technical Product Specification
Contents
4 Connectors ....................................................................................................................................70
4.1 Backplane Connectors........................................................................................................74
4.1.1 Power Distribution Connector (Zone 1)..................................................................74
4.1.2 Data Transport Connector (Zone 2).......................................................................75
4.1.3 Alignment Blocks ...................................................................................................76
4.2 Front Panel Connectors......................................................................................................77
4.2.1 USB Connector (J12).............................................................................................77
4.2.2 Serial Port Connector (J17) ...................................................................................77
4.2.3 Fibre Channel Small Form-Factor Pluggable (SFP) Receptacle (J34 and J35) ....80
4.2.4 Fibre Channel SFP Optical Transceiver Module....................................................80
4.2.5 PMC Connectors (J25, J26, J27)...........................................................................81
4.3 On-board Connectors .........................................................................................................84
4.3.1 IDE Connector (J24) ..............................................................................................84
5 Addressing.....................................................................................................................................85
5.1 Configuration Registers ......................................................................................................85
5.1.1 Configuration Address Register MCH CONFIG_ADDRESS .................................85
5.1.2 Configuration Data Register MCH CONFIG_ADDRESS.......................................85
5.2 I/O Address Assignments ...................................................................................................86
5.3 Memory Map.......................................................................................................................87
5.4 IPMC Addresses.................................................................................................................88
6 Specifications ................................................................................................................................89
6.1 Mechanical Specifications ..................................................................................................89
6.1.1 Board Outline.........................................................................................................89
6.1.2 Backing Plate.........................................................................................................92
6.1.3 Component Height.................................................................................................92
6.2 Environmental Specifications..............................................................................................97
6.3 Reliability Specifications .....................................................................................................97
6.3.1 Mean Time Between Failure (MTBF) Specifications..............................................97
6.3.1.1 Environmental Assumptions ..................................................................98
6.3.1.2 General Assumptions.............................................................................98
6.3.1.3 General Notes........................................................................................98
6.3.2 Power Consumption ..............................................................................................98
6.3.3 Cooling Requirements ...........................................................................................99
6.4 Board Layer Specifications .................................................................................................99
6.5 Weight.................................................................................................................................99
7 BIOS Features.............................................................................................................................100
7.1 Introduction .......................................................................................................................100
7.2 BIOS Flash Memory Organization ....................................................................................100
7.3 Complementary Metal-Oxide Semiconductor (CMOS).....................................................100
7.3.1 Copying and Saving CMOS Settings...................................................................100
7.4 Redundant BIOS Functionality .........................................................................................101
7.5 System Management BIOS (SMBIOS).............................................................................101
7.6 Legacy USB Support ........................................................................................................102
7.7 BIOS Updates...................................................................................................................102
7.7.1 Language Support ...............................................................................................103
7.8 Recovering BIOS Data .....................................................................................................103
7.9 Boot Options .....................................................................................................................103