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S1C63558 TECHNICAL MANUAL EPSON 171
CHAPTER 9: PAD LAYOUT
CHAPTER 9PAD LAYOUT
9.1 Diagram of Pad Layout
Chip thickness: 400 µm
Pad opening: 100 µm
X
Y
(0, 0)
4.01 mm
4.50 mm
151015202530
35
40
45
50
55
60
65 70 75 80 9085
95
100
105
110
115
120
122
Die No.