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82575 Ethernet Controller Design Guide
iv
5.3 Frequency Tolerance ..........................................................................................32
5.4 Temperature Stability and Environmental Requirements..........................................32
5.5 Calibration Mode................................................................................................33
5.6 Load Capacitance...............................................................................................33
5.7 Shunt Capacitance.............................................................................................34
5.8 Equivalent Series Resistance ...............................................................................34
5.9 Drive Level .......................................................................................................34
5.10 Aging...............................................................................................................34
5.11 Reference Crystal ..............................................................................................34
5.11.1 Reference Crystal Selection......................................................................35
5.11.2 Circuit Board..........................................................................................35
5.11.3 Temperature Changes .............................................................................35
6.0 Oscillator Support ....................................................................................................37
6.1 Oscillator Solution..............................................................................................37
7.0 Ethernet Component Layout Guidelines....................................................................39
7.1 Layout Considerations for 82575 Ethernet Controllers.............................................39
7.1.1 Guidelines for Component Placement.........................................................39
7.1.2 Crystals and Oscillators ...........................................................................42
7.1.3 Board Stack Up Recommendations............................................................43
7.1.4 Differential Pair Trace Routing for 10/100/1000 Designs ..............................44
7.1.5 Signal Trace Geometry for 1000 BASE-T Designs ........................................45
7.1.6 Trace Length and Symmetry for 1000 BASE-T Designs.................................45
7.1.7 Routing 1.8 V to the Magnetics Center Tap.................................................46
7.1.8 Impedance Discontinuities .......................................................................46
7.1.9 Reducing Circuit Inductance .....................................................................46
7.1.10 Signal Isolation ......................................................................................46
7.1.11 Power and Ground Planes ........................................................................47
7.1.12 Traces for Decoupling Capacitors ..............................................................47
7.1.13 Light Emitting Diodes for Designs Based on the 82575 Controller ..................47
7.1.14 Thermal Design Considerations.................................................................48
7.2 Physical Layer Conformance Testing.....................................................................48
7.2.1 Conformance Tests for 10/100/1000 Mbps Designs .....................................48
7.3 Troubleshooting Common Physical Layout Issues ...................................................48
8.0 Thermal Management ..............................................................................................50
9.0 Reference Design Bill of Materials............................................................................50
10.0 Design and Layout Checklists...................................................................................50
11.0 Reference Schematics..............................................................................................50
12.0 Symbol.....................................................................................................................50