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TECHNICAL DESCRIPTION
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ETC303(1) BINOS E e (2.0) 02/2007
Rosemount Analytical
1.3.2 Printed Circuit Boards
All necessary PCBs are placed into a cardcage, which is identically for all BINOS E versions
(see Fig. 1-7).
Fig. 1-7: Card Cage BINOS E, Top View
PCB
* For new models the combination PIC/PSV is replaced by a single DSP board.
LIO
(optional with 4 analog outputs
[optically isolated, common
ground] and RS 232 [optically
isolated] or CAN open bus
interface)
BINOS E Rear Panel
Interconnection Board
(ICB)
Cardcage
Signal Processing
(PSV*)
Physical Interface
(PIC*)
BINOS E Front Side