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Ballout and Package Information
R
134 Intel
®
82845 MCH for SDR Datasheet
7.1 Package Mechanical Information
This section provides the MCH package mechanical dimensions. The package is a 593 ball
FC-BGA.
Figure 8. Intel
®
MCH FC-BGA Package Dimensions (Top and Side View)
pkg_olga_593_top-side
Units = Millimeters
9.67
36.28
33.90
Top View
0.61
16.95
16.95
33.90
37.50
37.50
1.100 ±0.100
Die
0.152
A
Side View
Substrate
0.600 ±0.100
See Detail A
Detail A
0.74 ±0.025
0.10 ±0.025
Die Solder
Bumps
Underfill
Epoxy