Intel DBS1200V3RPS Computer Hardware User Manual


 
Mechanical Drawings
112 Thermal/Mechanical Specifications and Design Guidelines
Figure B-17. Thermocouple Attach Drawing
A
A
C
D
PACKAGE CENTER
REFERENCED FROM
PACKAGE EDGES
PACKAGE
EDGES
NOTE DIRECTION OF MILLED GROOVE
RELATIVE TO ALIGNMENT NOTCHES.
B
SECTION A-A
0.0150 ±0.0015
0.381 ±0.038
0.020 ±0.003
0.51 ±0.08
DETAIL B
SCALE 10 : 1
7.
0.031 ±0.006
0.79 ±0.15
0.015 ±0.001
0.38 ±0.03
0.040 ±0.010
1.02 ±0.25
DETAIL C
SCALE 15 : 1
PACKAGE
CENTER
2X R0.010 ±0.002
0.25 ±0.05
DETAIL D
SCALE 15 : 1
NOTES: UNLESS OTHERWISE SPECIFIED
1. NORMAL AND LATERAL LOADS ON THE IHS MUST BE
MINIMIZED DURING MACHINING.
2. MACHINE WITH CLEAN DRY AIR ONLY, NO FLUIDS OR
OILS.
3. ALL MACHINED SURFACES TO BE #32 MILL FINISH OR
BETTER.
4. IHS MATERIAL IS NICKEL PLATED COPPER.
5. CUT DIRECTION/ORIENTATION OF GROOVE IS AS SHOWN.
6. ALL MACHINED EDGES ARE TO BE FREE OF BURRS.
7. THE 0.0150 DEPTH AT THE PACKAGE CENTER IS CRITICAL.
4
A
3
PROJECTION
MATERIAL:
THIRD ANGLE
B
43
DO NOT SCALE DRAWING
DRAWING NUMBER
2
FINISH:
APPROVED BY
CHECKED BY
DRAWN BY
SCALE: 2:1
TITLE
DATE
B
SIZE
DATE
DATE
CAGE CODE
DESIGNED BY DATE
1
CHANDLER, ARIZONA 85226
SHEET 1 OF 1
REV
5000 W. CHANDLER BLVD.
A
B
1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED
IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR
MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
DWG. NO. SH. REV.
DEPARTMENT
TOL: .X
0.2 ANGLES: 0.5
.XX 0.05
.XXX
0.001
3/04/2008
3/04/2008
E38918
03
1
03
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN INCHES.
TOLERANCES:
INTERPRET DIM AND TOL PER
ASME Y14.5M-1994.
LGA 1160 IHS GROOVE FOR SOLDER
THERMOCOUPLE ATTACH