Filter
Top Products
Component Suppliers
94 Thermal/Mechanical Specifications and Design Guidelines
The enabled components may not be currently available from all suppliers. Contact the
supplier directly to verify time of component availability.
§
LGA115x ILM
cover only
G12451-001 012-1000-5377 475973003 1-2134503-1
ACA-ZIF-127-
P01
LGA115x ILM Back
Plate (with
screws)
E36143-002 PT44P19-6401 475969930 2069838-2
DCA-HSK-144-
Y09
1U ILM Back Plate
(with Screws)
E66807-001 PT44P18-6401 N/A N/A DCA-HSK-157-
Y03
Table A-5. Supplier Contact Information
Supplier Contact Phone Email
AVC
(Asia Vital
Components Co.,
Ltd.)
Kai Chang +86 755 3366 8888
x63588
kai_chang@avc.com.tw
Delta William Bradshaw +1 510 668-5570
+86 136 8623 1080
WBradshaw@delta-corp.com
Foxconn Julia Jiang
(for socket and ILM)
Ray Wang
(for heatsink)
+1 408 919 6178
+1 512 670 2638
juliaj@foxconn.com
ray.wang@foxconn.com
ITW Fastex Chak Chakir +1 512 989 7771 Chak.chakir@itweba.com
Lotes Co., Ltd. Windy Wong +1 604 721 1259 windy@lotestech.com
Molex Carol Liang +86 21 504 80889 x3301 carol.liang@molex.com
Nidec Karl Mattson +1 360 666 2445 karl.mattson@nidec.com
Tyco Billy Hsieh +81 44 844 8292 billy.hsieh@tycoelectronics.com
Table A-4. LGA1155 Socket and ILM Components (Sheet 2 of 2)
Item Intel PN Foxconn Molex Tyco Lotes