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Thermal/Mechanical Specifications and Design Guidelines 87
Active Tower Thermal Solution
10.4 Cooling Requirements
The processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is found in Chapter 6 of this document. The active tower
heatsink is able to keep the processor temperature within the specifications (see
Table 6-1) in chassis that provide good thermal management. For fan heatsink to
operate properly, it is critical that the airflow provided to the heatsink is unimpeded.
Airflow of the fan heatsink is into the front of fan and straight out of the heatsink rear
side. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life. Figure 10-6 illustrate an acceptable front airspace
clearance for the fan heatsink which is recommended to at least 15 mm or larger. The
air temperature entering the fan should be kept below 40 ºC. Again, meeting the
processor's temperature specification is the responsibility of the system integrator.
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Figure 10-6. Active Tower Heatsink Airspace Keepout Requirements (side view)