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Thermal Specifications
42 Thermal/Mechanical Specifications and Design Guidelines
Section 6.2. To ensure maximum flexibility for future processors, systems should be
designed to the Thermal Solution Capability guidelines, even if a processor with lower
power dissipation is currently planned.
Notes:
1. The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
- DMI and PCIe links are at L1.
2. Specification at Tj of 50 °C and minimum voltage loadline.
3. Specification at Tj of 35 °C and minimum voltage loadline.
4. These values are specified at V
CC_MAX
and V
NOM
for all other voltage rails for all processor frequencies.
Systems must be designed to ensure the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CCP
exceeds V
CCP_MAX
at specified I
CCP
. Please refer to the loadline specifications in
the datasheet.
5. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
6. Not 100% tested. Specified by design characterization.
7. When the Multi-monitor feature is enabled (running 4 displays simultaneously) there could be corner cases
with additional system thermal impact on the SA and VCCP rails ≤1.5W (maximum of 1.5W measured on
16 lane PCIe card). The integrator should perform additional thermal validation with Multi-monitor enabled
to ensure thermal compliance.
8. Guidelines provide a design target for meeting all planned processor frequency requirements. For more
detailed definition, please refer to latest processor Datasheet.
Table 6-1. Processor Thermal Specifications
Product Guidelines
8
Max
Power
Package
C1E
(W)
1,2,6
Max
Power
Package
C3
(W)
1,2,6
Max
Power
Package
C6
(W)
1,3,6
TTV
Thermal
Design
Power
(W)
4,5,7
Min T
CASE
(°C)
Maximum
TTV TCASE
(°C)
Intel
®
Xeon
®
Processor E3-
1280 (95W)
2011D 28 22 5.5 95
5
Figure 6-1
&Table 6-2
Intel
®
Xeon
®
processor E3-
1200 (80W)
2011D 28 22 5.5 80
Figure 6-2&
Table 6-3
Intel
®
Xeon
®
processor E3-
1260L (45W)
2011B 20 12 5.5 45
Figure 6-3&
Table 6-4
Intel
®
Xeon
®
processor E3-
1220L (20W)
2011A 18 10 5 20
Figure 6-4&
Table 6-5
Intel
®
Xeon
®
processor E3-
1200 (95W)
with integrated
graphics
2011D 28 22 5.5 95
Figure 6-5&
Table 6-6