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Thermal/Mechanical Specifications and Design Guidelines 83
Active Tower Thermal Solution
10 Active Tower Thermal Solution
10.1 Introduction
This active tower thermal solution is intended for system integrators who build systems
from baseboards and standard components. This chapter documents baseboard and
system requirements for the cooling solution. It is particularly important for OEMs that
manufacture baseboards for system integrators.
Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. Figure 10-1 shows a mechanical representation of the active
tower thermal solution.
Note: Drawings in this chapter reflect only the specifications on this active tower thermal
solution. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the desktop processor thermal mechanical design guide
for further guidance on keep in and keep out zones.
Figure 10-1. Mechanical Representation of the Solution